| Description |
1 online resource |
| Contents |
Front Cover; Title Page; Copyright Page; About the Author; Contents; List of Abbreviations; Preface; Acknowledgments; Introduction; Part I: Custom Formulating; Chapter 1: Materials and Process Engineering; Chapter 2: The Art and Science of Formulating; Part II: Thermal Transfer Adhesives for Space Electronics; Chapter 3: Thermal Transfer, Filleting Adhesives; Chapter 4: Flexible Epoxy Thermal Transfer Adhesives For Flatpacks; Chapter 5: More About the New Thermal Transfer Adhesives; Chapter 6: Superior Thermal Transfer Adhesive |
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Part III: Other Custom-Formulated Compounds for Aerospace Electronics ApplicationsChapter 7: Radiopaque Adhesive/Sealant; Chapter 8: Low Exotherm, Low-Temperature Curing, Epoxy Impregnants; Chapter 9: Platable Adhesives For Cyanate Ester Composites; Chapter 10: Reworkable, Thermally Conductive, Adhesives For Electronic Assemblies; Chapter 11: Room Temperature-Stable, One-Component, Flexible Epoxy Adhesives; Part IV: Custom-Formulated Compounds for Automotive Electronics Applications; Chapter 12: Air Bag Sensor Encapsulation; Chapter 13: Reactive Hot Melt Conformal Coating Materials |
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Chapter 14: Solder Joint Lead EncapsulationPart V: Custom-Formulated Organic Solder to Eliminate Lead; Chapter 15: Formulation of a Drop-Resistant, Organic Solder; Part VI: Rigid Polyurethanes for Aircraft Transparencies; Chapter 16: Sierraclad"!Bird-Proof Canopies and Windshields; Part VII: Three Niche Technologies; Chapter 17: Flexipoxy Technology; Chapter 18: Hacthane Technology; Chapter 19: Transparent Polyurethane Plastics; Part VIII: Spin-Off Applications; Chapter 20: Spin-Off From Our Thermal Transfer Adhesives Patents |
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Chapter 21: Spin-Off From Our Electrically Conductive Adhesives PatentsChapter 22: Spin-Off From Our Encapsulants, Potting Compounds, and Impregnants Patents; Chapter 23: Spin-Off From Our High-Volume Electronic Assembly Materials Patents; Chapter 24: Spin-Off From Our Specialty Adhesives Patents; Chapter 25: Spin-Off From Our Specialty Rigid Thermosets Patents; Appendix I: The Science of Rubbery Materials; Back Cover |
| Summary |
"Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During the author's 40-year career he has successfully worked on many such problems. The uniquely useful and valuable book, Polymeric Thermosetting Compounds: Innovative Aspects of Their Formulation Technology, presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. Author Ralph Hermansen, with years of experience of hands-on experience, is an expert in formulating epoxies, polyurethanes, and other polymers into compounds that have unique properties, and here he shares his knowledge and experience of attaining novel solutions to very challenging problems."-- Provided by publisher |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record and CIP data provided by publisher; resource not viewed |
| Subject |
Thermosetting plastics.
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Thermosetting composites.
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Heat resistant plastics.
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Materials at high temperatures.
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Materials at low temperatures.
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Polymers.
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Elastomers.
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thermoset.
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polymers.
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elastomer.
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TECHNOLOGY & ENGINEERING -- Chemical & Biochemical.
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Elastomers.
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Heat resistant plastics.
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Materials at high temperatures.
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Materials at low temperatures.
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Polymers.
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Thermosetting composites.
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Thermosetting plastics.
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| Form |
Electronic book
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| LC no. |
2016024240 |
| ISBN |
9781771883153 |
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1771883154 |
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1771883146 |
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9781771883146 |
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