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Author
International Workshop on Stress-Induced Phenomena in Metallization (7th : 2004 : Austin, Tex.)
Title
Stress-induced phenomena in metallization : Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004 / editors, Paul S. Ho [and others]
Published
Melville, N.Y. : American Institute of Physics, 2004
Copies
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Call no.
Vol.
Availability
W'PONDS
621.38152 Int/Sip 2004
AVAILABLE
Description
1 online resource (vii, 272 pages) : illustrations
Series
AIP conference proceedings, 0094-243X ; v. 741
AIP conference proceedings ; no. 741
Contents
Fracture and reliability for low k dielectrics -- Electromigration -- Thermal stresses and void formation
Notes
"Held at the University of Texas at Austin"--Preface
Bibliography
Includes bibliographical references and indexes
Notes
Also available via the World Wide Web
English
Description based on print version record
Subject
Copper -- Electric properties -- Congresses.
Damascening -- Congresses.
Dielectric films -- Defects -- Congresses.
Electrodiffusion -- Congresses.
Integrated circuits -- Defects -- Congresses.
Interconnects (Integrated circuit technology) -- Defects -- Congresses.
Metallic films -- Defects -- Congresses.
Semiconductors -- Defects -- Congresses.
Metallizing -- Congresses.
Thin film devices -- Defects -- Congresses.
Genre/Form
Conference papers and proceedings.
Author
Ho, P. S.
LC no.
2004116273
Other Titles
Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004
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